For soldering 44-pin chip carriers to a board using soldering preforms, power levels were on the order of 10 Watts and solder times approximately 1 second.
12.
Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J . Leadless chip carriers have metal pads on the edges.
13.
Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J . Leadless chip carriers have metal pads on the edges.
14.
In the 1980s pin counts of VLSI circuits exceeded the practical limit for DIP packaging, leading to pin grid array ( PGA ) and leadless chip carrier ( LCC ) packages.
15.
Cook ware, microwave oven, microwave oven parts, coiling parts, insulation in small application part, semiconductor handling devices, parts of electric motors and stators, socket, connector, chip carriers and PCBs.
16.
It was fabricated in DEC's ZMOS process, a 3.0 �m NMOS process with two layers of aluminum interconnect; and is packaged in a 68-pin surface-mounted leaded chip carrier.
17.
In the 580 systems, the chips were mounted in an 11-by-11 array on multi-layer boards called Multi-Chip Carriers ( MCCs ) that were positioned in high-airflow for cooling.
18.
The "'GAL22V10 "'is a series of programmable-logic devices implemented as CMOS-based generic array logic ICs, created by Lattice Semiconductor, and available as a Dual inline package or a Plastic leaded chip carrier.
19.
The boards were then turned over and mated to a second board carrying the electrical wiring, with wires on this card running through holes to the " bottom " ( opposite the chips ) side of the chip carrier where they were bonded, hence sandwiching the chip between the two layers of board.
20.
Their use has declined in the first decade of the 21st century due to the emerging new surface-mount technology ( SMT ) packages such as plastic leaded chip carrier ( PLCC ) and small-outline integrated circuit ( SOIC ), though DIPs continued in extensive use through the 1990s, and still continue to be used substantially as the year 2011 passes.
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