11. "' Flip chip "'is a method of flipping over the chip to connect with either substrate or leadframe. 12. An upgrade to the Flip Chip led to the R series, which in turn led to the PDP-7A in 1965. 13. MIL-STD-883 methods 2011.9 destructive bond pull test and 2031.1 flip chip pull off test apply, as well as JEDEC JESD22-B109. 14. The Low Cost Flip Chip Consortium was one of 10 cooperative research consortia announced December 6 by the Justice Department. 15. Some boards containing flip chip modules were etched and drilled to allow those modules to be replaced by discrete components. 16. In 1964 DEC introduced its new Flip Chip module design, and used it to re-implement the PDP-4 as the PDP-7. 17. DEC continued to hold the " flip chip " trademark until June 6, 1987, when the trademark was allowed to expire. 18. Today, flip chip is a well established technology and collapsed soft solder connections are used in the vast majority of assemblies. 19. Figure 2 is a photo of EN plated bumps on a flip chip , something impossible to accomplish with an electroplated deposit. 20. On 22 March 1965, DEC introduced the PDP-8, which replaced the PDP-5's modules with the new R-series modules using Flip Chips .
