11. 9 is the upper and lower specification limits for individual solder paste height measurements also defined 12. Solder paste , screen printing , use ways , printing process course will decide the printing quality13. In this process , a standard stencil printing technique is used to print solder paste directly onto silicon wafers ( figure 4 ) 14. Figure 5 . transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co - planarity 15. Lf305a is designed for widely electronic assembly applications . it is a lead - free , mildly active solder paste 16. We should judge the adhibit of solder paste before screen printing by automatic machine or by hand 17. Solder paste is applying for the connection between the mount components foot and pcb pads in the smt assembly18. Attachment materials for electronic assembly - requirements for solder pastes for high - quality interconnections in electronic assembly 19. More than 3 years working experiences in smt processing and strong willing to be a technical sales in selling lead - free solder paste 20. More than 5 years working experiences in smt process . familiar with technical , equipment , process of lead - free solder paste
