Potassium ferricyanide is combined with potassium hydroxide ( or sodium hydroxide as a substitute ) and water to formulate Murakami's etchant.
22.
For many etch steps, part of the wafer is protected from the etchant by a " masking " material which resists etching.
23.
This etchant reveals clearly defined oxidation-induced stacking faults, dislocations, swirls and striations with minimum surface roughness or extraneous pitting.
24.
Initially, that new process was designed to utilize spent etchant streams from the electronic printed circuit board manufacturing industry as starting materials.
25.
The resulting shape depends on the type of material, the concentration of the etchant, and the temperature of the etch bath.
26.
Adjustment of the nozzle pattern, flow rate, temperature, and etchant composition gives predictable control of etching rates and high production rates.
27.
Hydrofluoric acid dissolves glass and other silicates, by a mechanism noted at Hydroflouric _ acid # Etchant _ and _ cleaning _ agent.
28.
Important variables are the amount of time the etchant is applied, the type of etchant used, and the current condition of the enamel.
29.
Important variables are the amount of time the etchant is applied, the type of etchant used, and the current condition of the enamel.
30.
A solution of ferric chloride etchant is applied to the surface of the cylinder, where it eats away the copper through the carbon tissue.
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