Around this time, Delco sought to commercialize its technology and formed Flip Chip Technologies with Kulicke & Soffa Industries as a partner.
22.
According to the research firm Yole D�veloppement, the flip chip technology market value is expected to reach $ 25 billion in 2020.
23.
At least one computer manufacturer, IBM, built its own flip chip integrated circuits with TTL; these chips were mounted on ceramic multi-chip modules.
24.
IBM chose to design custom hybrid circuits using discrete, flip chip-mounted, glass-encapsulated transistors and diodes, with silk screened resistors on a ceramic substrate.
25.
High quality spherical glass microspheres are often used in gas plasma displays, automotive mirrors, electronic displays, flip chip technology, filters, microscopy, and electronic equipment.
26.
During that decade, however, the industry was forced to find new techniques when it developed sophisticated methods for packaging chips, known as " flip chip " modules.
27.
A form factor called "'SECC2 "'was used for late Pentium II and Pentium III CPUs for Slot 1, which was created to accommodate the switch to flip chip packaging.
28.
For example, the " Micro-FCBGA " ( Flip Chip Ball Grid Array ) is Intel's current BGA mounting method for mobile processors that use a flip chip binding technology.
29.
For example, the " Micro-FCBGA " ( Flip Chip Ball Grid Array ) is Intel's current BGA mounting method for mobile processors that use a flip chip binding technology.
30.
The company also states to have qualified solder bump versions of the same two chipsets to be used for flip chip mounting, the preferred assembly technology in high-volume production.
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